Physics

Dr. Burkhard Fechner
Coherent GmbH, Goettingen, Germany

Burkhard Fechner (A), Ralph Delmdahl (A), Matthew Gingerella (B)
 
(A)  Coherent LaserSystems GmbH & Co. KG, Hans-Boeckler-Str. 12, 37079 Goettingen, Germany.
(B)  SUSS MicroTec Photonic Systems, Inc., 220 Klug Circle, Corona, California 92880-5409, USA.
 
Next-generation advanced packages exhibiting smaller feature sizes, tighter pitches, embedded connectors or interposers rely on high precision structuring of thin organic substrates beyond the limitations of conventional photolithography. Excimer laser ablation as a dry-single step process eliminates the need for conventional, wet chemistry based, multi-step photolithography and applies to any type of organic substrate material.
Mask imaging in conjunction with a step and scan process architecture delivers unmatched placement accuracy of essential structures such as trenches for redistribution layers and micron-size vias accurately connecting contact pads. Achievable via diameters, layer-selectivity and ablation rates will be discussed.